|本期目录/Table of Contents|

[1]曾浪芸,苏海冰.分层模型通孔通道的等效电容参数快速提取[J].电子设计工程,2019,27(22):188-193.
 ZENG Langyun,SU Haibing.Fast extraction of equivalent capacitance parameters of through?hole channel of hierarchical model[J].SAMSON,2019,27(22):188-193.
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分层模型通孔通道的等效电容参数快速提取(PDF)
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《电子设计工程》[ISSN:1674-6236/CN:61-1477/TN]

卷:
27
期数:
2019年22期
页码:
188-193
栏目:
电力电子技术
出版日期:
2019-11-20

文章信息/Info

Title:
Fast extraction of equivalent capacitance parameters of through?hole channel of hierarchical model
文章编号:
1674-6236(2019)22-0188-06
作者:
曾浪芸12苏海冰1
(1.中国科学院 光电技术研究所,四川 成都 610209;?2.中国科学院大学 北京 100049)
Author(s):
ZENG Lang?yun12SU Hai?bing1
(1. Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, China;2. University of Chinese Academy of Sciences, Beijing 100049, China)
关键词:
高速设计 通孔电容 电容耦合效应 分层模型 同轴线导体 Hyperlynx仿真
Keywords:
high-speed design through-hole capacitance capacitive coupling effect hierarchical model coaxial line conductor hyperlynx simulation
分类号:
TN405
DOI:
-
文献标志码:
A
摘要:
针对高速数字设计电路中通孔通道结构中存在的电容耦合效应,成功采用了同轴线导体物理模型对通孔通道互连结构进行分层模型分析。该方法直接获得了各分层对地电容解析解,且计算高效,快捷。该解析解包含了通孔通道的详细设计参数,每一个分布电容都具有其具体的物理意义。与商业软件Hyperlynx内置求解器结果进行了对比,其理论计算结果和仿真结果之间误差小,在7%以内。此方法能够用到对任意层印制电路板过孔电容的提取工作中,为过孔的等效电路建模和后续的高速信号完整性分析提供了方便。
Abstract:
Aiming at the capacitive coupling effect in the via-channel structure in the high-speed digital design circuit, the physical model of the coaxial line conductor is used to analyze the through-hole channel of hierarchical model successfully. The analytical solution of the capacitance of each layer to the ground have been gotten directly by that method. And the analytical solution is efficient and fast in calculation. It contains detailed design parameters for the through-hole channel, and each distributed capacitor has its specific physical meaning. Compared with the results of the solver built in the commercial software Hyperlynx, the error between the theoretical calculation results and the simulation results is small, which is within 7%. This method can be used to extract the via capacitance of any printed circuit board. It is convenient for via equivalent circuit modeling and subsequent high-speed signal integrity analysis.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期:2019-03-29 稿件编号:201903198作者简介:曾浪芸(1992—),男,四川广安人,硕士。研究方向:高速数字设计及仿真。
更新日期/Last Update: 2019-11-25